Plasma Etcher, Model PE 2000
The PE 2000 RF Plasma Etcher is specifically designed for reactive gas plasma etching and surface treatments. The unit is capable of 150 watts RF forward power at 13.56 MHz and up to four gas processing. The system is ideal for R&D applications where single sample processing is needed and total control of each process parameter is necessary.
Detailní popis
Processes such as photoresist strips, BPSG removal, oxide and nitride layer etch, surface treatment of plastics and plasma cleaning are typical applications. Samples up to 6" diameter as well as irregular shaped substrates can be accommodated in the 200mm diameter vacuum chamber. A fully manual control system coupled with digital readouts and integral matching network with switching type power generator offer a wide range of experimental etch parameters
Special Features
- High etch rates at moderate power levels of 100 watts forward power can be achieved - 200 Å/minute for oxide and 500Å/minute for nitride.
- Stainless steel gas system with three-position feed provides maximum etch uniformity and the best possible utilization of the reactive species. Includes a separate vent to atmosphere line.
- Gas lines, fittings and stage assembly are all stainless steel construction and designed for corrosive applications – A Fomblin charged corrosive series rotary vane pump is included.
- Safety interlocks prevent mis-operation thereby protecting the user and the system.
- Manual controls, with digital readouts, make it possible to process in a wide range of vacuum pressure levels using an unlimited combination of reactive species including oxygen, fluorine and chlorine.
- System is supplied with two manual gas channels, but up to four mass flow channels can be added.
Specifications
Vacuum Pump: 431/min two stage direct drive corrosive series pump. System base pressure 20 millitorr; Typical operating pressure 50-200 millitorr Vacuum Readout: Capacitance manometer with digital front panel display in millitorr Vacuum Chamber: Quartz, 8" OD x 4" high RF Power: User variable 0-150 watt; 13.56 MHz frequency; manual tune; air cooled; solid state design Process Timer: Auto-termination of etch up to 99:99:59 Input Power: 115/230 VA, 50/60 Hz, 10/5 amps Dimensions: 20.25" W x 16" D x 15" H System Vent: Independent interlocked solenoid with connection for dry nitrogen Gas Delivery: Two channels independently controlled with precision needle valves and positive off solenoid valves. Normally closed solenoids eliminate any gas flow in the event of a power loss Gas Control: Dual independent needle valves with safety interlocked solenoid Sample Table: 6" diameter stainless steel RF Readouts: Digital front panel LCD meters for forward and reflected power DC Bias: Digital/front panel LCD meter System Weight: 60 pounds (without rotary pump) Warranty: 1 year on parts and labor Options: Stainless steel chamber with view ports; Mass Flow Controller System up to four channels; Cold Cathode Gauge
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