#5201 GRID BENDING JIG W/COVER

Detailní popis

#5201 Grid Bending Jig with Cover

The MicroCleave technique is a relatively simple and inexpensive method of producing superior cross sectional TEM specimens. For speed in preparation, it is unsurpassed. One limitation of the technique is that it does require the substrate material to be cleaved or fractured. For this reason, it has been applied almost exclusively to semiconductor materials. Recently, the technique has been extended to other substrates, such as glass, silicon carbide, quartz, sapphire, and other hard materials. It is particularly well suited for rapidly examining coatings and thin films very soon after they are deposited.

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